PRINTED CIRCUIT BOARD WITH AN INSULATED METAL SUBSTRATE

The invention relates to a printed circuit board (1) with an insulated metal substrate, comprising a metal carrier (2), an insulating layer (4) and a metal layer (3) on which at least one electronic component (5) is mounted in at least one mounting zone (3A) of the metal layer (3), characterized in...

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Bibliographische Detailangaben
Hauptverfasser:	TALON, EMMANUEL, MACHET, FRANÇOIS, DUPUIS, DOMINIQUE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention relates to a printed circuit board (1) with an insulated metal substrate, comprising a metal carrier (2), an insulating layer (4) and a metal layer (3) on which at least one electronic component (5) is mounted in at least one mounting zone (3A) of the metal layer (3), characterized in that each mounting zone (3A) is a raised zone of the metal layer (3).