HIGH-FREQUENCY MODULE
There is provided a high frequency module including a part mounted on one surface of a board; an electrode for connecting the part formed on the one surface and an apparatus for mounting the high frequency module; and a first insulating layer, which is formed on the one surface and is configured to...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | There is provided a high frequency module including a part mounted on one surface of a board; an electrode for connecting the part formed on the one surface and an apparatus for mounting the high frequency module; and a first insulating layer, which is formed on the one surface and is configured to cover the part, wherein the electrode is formed on a surface of the first insulating layer such that at least a part of the electrode and the first insulating layer are successively formed. |
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