Aqueous secondary copolymer dispersions with a low organic solvent content

An aqueous secondary copolymer dispersion comprises a copolymer (P) obtained by a process comprising the steps of: A) introducing at least one organic solvent into a reaction vessel, whereby the organic solvent optionally comprises a polymer containing hydroxyl groups; B) introducing an initiator co...

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Bibliographische Detailangaben
Hauptverfasser:	GEWIS, HEINZ-DIETMAR, MELCHIORS, MARTIN, IRLE, CHRISTOPH, YUVA, NUSRET, SCHRINNER, MARC CLAUDIUS, AVTOMONOV, EVGENY
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
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Beschreibung
Zusammenfassung:	An aqueous secondary copolymer dispersion comprises a copolymer (P) obtained by a process comprising the steps of: A) introducing at least one organic solvent into a reaction vessel, whereby the organic solvent optionally comprises a polymer containing hydroxyl groups; B) introducing an initiator component into that vessel; C) adding and polymerizing a monomer mixture comprising monomers containing hydroxyl groups in that vessel and D) adding and polymerizing a monomer mixture comprising monomers containing hydroxyl and acid groups in that vessel. The polymerization is conducted in the presence of an organic solvent selected from the group consisting of ethers, esters, ketones and alcohols, the solvent having a boiling point of ‰¥ 35 °C and ‰¤ 120 °C and the organic solvent is at least partially removed after in step G). The invention also concerns the use of such dispersions in coating and/or adhesive materials.