Conductive pattern film substrate and manufacturing method

A conductive pattern film substrate and manufacturing method for combining two anisotropic materials, namely a patterned body and a film layer, without assistance from an intermediate layer. The method includes producing a thermal spraying source for performing a heating operation on a film material...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LIU, SONG-JHE, CHANG, JACKY, LIN, ERIC
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GRINDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS POLISHING PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A conductive pattern film substrate and manufacturing method for combining two anisotropic materials, namely a patterned body and a film layer, without assistance from an intermediate layer. The method includes producing a thermal spraying source for performing a heating operation on a film material to prepare the film material for thermal spraying or semi-thermal spraying and thereby decompose the film material into film particles; and spraying the film particles to a pattern layer disposed on the body and having the pattern by the thermal spraying source to form the film layer having the film particle on the pattern layer, thereby enabling the body to embody electrical characteristics of the pattern.