ELECTROCONDUCTIVE MATERIAL, METHOD OF CONNECTION WITH SAME, AND CONNECTED STRUCTURE

There are provided a conductive material having a first metal and a second metal whose diffusibility in a soldering step is so good that a high-melting point intermetallic compound is generated at a low temperature and in short time, leaving no first metal after soldering and having excellent streng...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKANO, KOSUKE, TAKAOKA, HIDEKIYO
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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