ELECTROCONDUCTIVE MATERIAL, METHOD OF CONNECTION WITH SAME, AND CONNECTED STRUCTURE
There are provided a conductive material having a first metal and a second metal whose diffusibility in a soldering step is so good that a high-melting point intermetallic compound is generated at a low temperature and in short time, leaving no first metal after soldering and having excellent streng...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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