ELECTROCONDUCTIVE MATERIAL, METHOD OF CONNECTION WITH SAME, AND CONNECTED STRUCTURE

There are provided a conductive material having a first metal and a second metal whose diffusibility in a soldering step is so good that a high-melting point intermetallic compound is generated at a low temperature and in short time, leaving no first metal after soldering and having excellent streng...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NAKANO, KOSUKE, TAKAOKA, HIDEKIYO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CASTING CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS POWDER METALLURGY SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	There are provided a conductive material having a first metal and a second metal whose diffusibility in a soldering step is so good that a high-melting point intermetallic compound is generated at a low temperature and in short time, leaving no first metal after soldering and having excellent strength in high temperature when used as a solder paste for example, and a bonding method and a bonded structure with high bonding reliability using the same. The conductive material should include a metal component consisting of a first metal and a second metal having a melting point higher than that of the first metal, wherein the first metal is Sn or an alloy containing 70% by weight or more of Sn, and the second metal is a metal or alloy which forms an intermetallic compound showing a melting point of 310°C or higher with the first metal and has a lattice constant difference of 50% or greater between itself and the intermetallic compound generated at the circumference of the second metal. In addition, the ratio of the second metal to the metal component is 30% by volume or greater. A Cu-Mn alloy or a Cu-Ni alloy is used as the second metal.