METHOD FOR MOUNTING A COMPONENT IN OR ON A CIRCUIT BOARD, AND CIRCUIT BOARD

In a method for mounting an element or component having at least one metal surface in or on a circuit board containing at least one conducting layer made of metal material, a connection between the at least one metal surface of the element and the at least one conducting layer of the circuit board i...

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Bibliographische Detailangaben
Hauptverfasser:	DROFENIK, DIETMAR, WEICHSLBERGER, GUENTHER
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	In a method for mounting an element or component having at least one metal surface in or on a circuit board containing at least one conducting layer made of metal material, a connection between the at least one metal surface of the element and the at least one conducting layer of the circuit board is formed using ultrasonic welding or high-frequency friction welding in order to create a mechanically stable and resistant connection or attachment having good conductivity. Furthermore, a circuit board is disclosed in which at least one element or component having a metal surface is or can be connected to a conducting or conductive layer of the circuit board using ultrasonic welding or high-frequency friction welding.