SEMICONDUCTOR MODULE

A semiconductor module (1, 2, 3, 4, 5) which includes a semiconductor device (10); a wiring member (20, 22) that is connected to the semiconductor device; a cooling plate (50,501,502, 503,504) that includes a first surface on a side of the semiconductor device and a second surface on a side opposite...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MIYOSHI, TATSUYA, KAJI, MASAYA, OKUMURA, TOMOMI, SUZUKI, YOSHIKAZU, KADOGUCHI, TAKUYA, KAWASHIMA, TAKANORI, NAKAJIMA, KIYOFUMI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor module (1, 2, 3, 4, 5) which includes a semiconductor device (10); a wiring member (20, 22) that is connected to the semiconductor device; a cooling plate (50,501,502, 503,504) that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion (52,521,522,524a +524b) at an end thereof in a first direction (Y); and a molded portion (60) that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction (X) which is substantially perpendicular to the first direction (Y).