OVENABLE HEAT-SEALED PACKAGE

A package comprises a heat seal between a first film and a second film. The first film comprises at least 70% of one or more polyamides. The first film also comprises at least one modified layer comprising (1) at least 70% of one or more polyamides and (2) one or more modifiers selected from ethylen...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	BREBION, Herve
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A package comprises a heat seal between a first film and a second film. The first film comprises at least 70% of one or more polyamides. The first film also comprises at least one modified layer comprising (1) at least 70% of one or more polyamides and (2) one or more modifiers selected from ethylene/alkyl(meth)acrylate copolymers, ethylene/(meth)acrylic acid copolymers, and ionomers. The second film comprises at least 70%) of one or more polyamides. The package is useful under ovenable conditions.