SENSOR MODULE FOR RECEIVING A PRESSURE SENSING CHIP AND FOR ASSEMBLING IN A SENSOR HOUSING
In a sensor module for accommodating a pressure sensor chip and for installation into a sensor housing, a module wall is connected monolithically to the module bottom and surrounds the pressure sensor chip. Multiple connecting elements which are conducted through the module wall to the outside run s...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | GMELIN, Christoph VOLLERT, Jens WELTER, Aline HERRMANN, Reinhold SCHELLKES, Eckart LUX, Alexander |
| description | In a sensor module for accommodating a pressure sensor chip and for installation into a sensor housing, a module wall is connected monolithically to the module bottom and surrounds the pressure sensor chip. Multiple connecting elements which are conducted through the module wall to the outside run straight at least in the entire outside area. Furthermore, the connecting elements are exposed on their top and bottom sides for affixing and electrically connecting at least one electrical component and for electrically integrating the sensor module into the sensor housing. In this way, a two-sided use of a sensor module having an identical external geometry and identical connectors is possible. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2606329B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2606329B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2606329B13</originalsourceid><addsrcrecordid>eNrjZIgKdvUL9g9S8PV3CfVxVXADMoNcnV09wzz93BUcFQKCXIODQ4NcFUDKQELOHp4BCo5-LmCVjsHBrr5OPiBxTz-gaqhZHv6hILU8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSTeNcDIzMDM2MjSydCYCCUA2EIxKQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SENSOR MODULE FOR RECEIVING A PRESSURE SENSING CHIP AND FOR ASSEMBLING IN A SENSOR HOUSING</title><source>esp@cenet</source><creator>GMELIN, Christoph ; VOLLERT, Jens ; WELTER, Aline ; HERRMANN, Reinhold ; SCHELLKES, Eckart ; LUX, Alexander</creator><creatorcontrib>GMELIN, Christoph ; VOLLERT, Jens ; WELTER, Aline ; HERRMANN, Reinhold ; SCHELLKES, Eckart ; LUX, Alexander</creatorcontrib><description>In a sensor module for accommodating a pressure sensor chip and for installation into a sensor housing, a module wall is connected monolithically to the module bottom and surrounds the pressure sensor chip. Multiple connecting elements which are conducted through the module wall to the outside run straight at least in the entire outside area. Furthermore, the connecting elements are exposed on their top and bottom sides for affixing and electrically connecting at least one electrical component and for electrically integrating the sensor module into the sensor housing. In this way, a two-sided use of a sensor module having an identical external geometry and identical connectors is possible.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180912&DB=EPODOC&CC=EP&NR=2606329B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180912&DB=EPODOC&CC=EP&NR=2606329B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GMELIN, Christoph</creatorcontrib><creatorcontrib>VOLLERT, Jens</creatorcontrib><creatorcontrib>WELTER, Aline</creatorcontrib><creatorcontrib>HERRMANN, Reinhold</creatorcontrib><creatorcontrib>SCHELLKES, Eckart</creatorcontrib><creatorcontrib>LUX, Alexander</creatorcontrib><title>SENSOR MODULE FOR RECEIVING A PRESSURE SENSING CHIP AND FOR ASSEMBLING IN A SENSOR HOUSING</title><description>In a sensor module for accommodating a pressure sensor chip and for installation into a sensor housing, a module wall is connected monolithically to the module bottom and surrounds the pressure sensor chip. Multiple connecting elements which are conducted through the module wall to the outside run straight at least in the entire outside area. Furthermore, the connecting elements are exposed on their top and bottom sides for affixing and electrically connecting at least one electrical component and for electrically integrating the sensor module into the sensor housing. In this way, a two-sided use of a sensor module having an identical external geometry and identical connectors is possible.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIgKdvUL9g9S8PV3CfVxVXADMoNcnV09wzz93BUcFQKCXIODQ4NcFUDKQELOHp4BCo5-LmCVjsHBrr5OPiBxTz-gaqhZHv6hILU8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSTeNcDIzMDM2MjSydCYCCUA2EIxKQ</recordid><startdate>20180912</startdate><enddate>20180912</enddate><creator>GMELIN, Christoph</creator><creator>VOLLERT, Jens</creator><creator>WELTER, Aline</creator><creator>HERRMANN, Reinhold</creator><creator>SCHELLKES, Eckart</creator><creator>LUX, Alexander</creator><scope>EVB</scope></search><sort><creationdate>20180912</creationdate><title>SENSOR MODULE FOR RECEIVING A PRESSURE SENSING CHIP AND FOR ASSEMBLING IN A SENSOR HOUSING</title><author>GMELIN, Christoph ; VOLLERT, Jens ; WELTER, Aline ; HERRMANN, Reinhold ; SCHELLKES, Eckart ; LUX, Alexander</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2606329B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>GMELIN, Christoph</creatorcontrib><creatorcontrib>VOLLERT, Jens</creatorcontrib><creatorcontrib>WELTER, Aline</creatorcontrib><creatorcontrib>HERRMANN, Reinhold</creatorcontrib><creatorcontrib>SCHELLKES, Eckart</creatorcontrib><creatorcontrib>LUX, Alexander</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GMELIN, Christoph</au><au>VOLLERT, Jens</au><au>WELTER, Aline</au><au>HERRMANN, Reinhold</au><au>SCHELLKES, Eckart</au><au>LUX, Alexander</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SENSOR MODULE FOR RECEIVING A PRESSURE SENSING CHIP AND FOR ASSEMBLING IN A SENSOR HOUSING</title><date>2018-09-12</date><risdate>2018</risdate><abstract>In a sensor module for accommodating a pressure sensor chip and for installation into a sensor housing, a module wall is connected monolithically to the module bottom and surrounds the pressure sensor chip. Multiple connecting elements which are conducted through the module wall to the outside run straight at least in the entire outside area. Furthermore, the connecting elements are exposed on their top and bottom sides for affixing and electrically connecting at least one electrical component and for electrically integrating the sensor module into the sensor housing. In this way, a two-sided use of a sensor module having an identical external geometry and identical connectors is possible.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP2606329B1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | SENSOR MODULE FOR RECEIVING A PRESSURE SENSING CHIP AND FOR ASSEMBLING IN A SENSOR HOUSING |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T19%3A42%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GMELIN,%20Christoph&rft.date=2018-09-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP2606329B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |