SENSOR MODULE FOR RECEIVING A PRESSURE SENSING CHIP AND FOR ASSEMBLING IN A SENSOR HOUSING

In a sensor module for accommodating a pressure sensor chip and for installation into a sensor housing, a module wall is connected monolithically to the module bottom and surrounds the pressure sensor chip. Multiple connecting elements which are conducted through the module wall to the outside run s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GMELIN, Christoph, VOLLERT, Jens, WELTER, Aline, HERRMANN, Reinhold, SCHELLKES, Eckart, LUX, Alexander
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	In a sensor module for accommodating a pressure sensor chip and for installation into a sensor housing, a module wall is connected monolithically to the module bottom and surrounds the pressure sensor chip. Multiple connecting elements which are conducted through the module wall to the outside run straight at least in the entire outside area. Furthermore, the connecting elements are exposed on their top and bottom sides for affixing and electrically connecting at least one electrical component and for electrically integrating the sensor module into the sensor housing. In this way, a two-sided use of a sensor module having an identical external geometry and identical connectors is possible.