Integrated component with conductive adhesive bond

The fastener (10) has dielectric passivation layer provided on surface of semiconductor structure (20). An oxide layer (40) is provided below trace (45) which is provided below passivation layer. A frictional connection is formed between component (60) arranged above passivation layer, and semicondu...

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Bibliographische Detailangaben
Hauptverfasser:	WILBERTZ, CHRISTOPH, FRERICHS, HEINZ-PETER, KOLLETH, TOBIAS
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	The fastener (10) has dielectric passivation layer provided on surface of semiconductor structure (20). An oxide layer (40) is provided below trace (45) which is provided below passivation layer. A frictional connection is formed between component (60) arranged above passivation layer, and semiconductor structure by connecting unit (80). A mold (70) is pressed through passivation and oxide layers. The electrical connection is formed between conductive layer provided on bottom surface, and/or on lateral surface of mold, and component by connecting unit with organic polymer.