Laser drilling of through boreholes without internal protection

The Trepanier method of producing a through-hole (25) in a wall (10) of a hollow component by a millisecond laser and a nanosecond laser having short laser pulses of 0.1-0.3 ms, a relatively high pulse frequency of 20-30 Hz and very low energy of 2-3 Joules and adapting a focus position (13) of the laser beam, is claimed. A maximum of 10% of the thickness of the wall of the hollow component is removed, and an overlying area is removed with high energy, pulse durations and/or higher frequencies with a difference of 20%. The through-hole is produced in a cavity (4) behind the wall. The Trepanier method of producing a through-hole (25) in a wall (10) of a hollow component by a millisecond laser and a nanosecond laser having short laser pulses of 0.1-0.3 ms, a relatively high pulse frequency of 20-30 Hz and very low energy of 2-3 Joules and adapting a focus position (13) of the laser beam, is claimed. A maximum of 10% of the thickness of the wall of the hollow component is removed, and an overlying area is removed with high energy, pulse durations and/or higher frequencies with a difference of 20%. The through-hole is produced in a cavity (4) behind the wall. The focus of the laser beam is present in the through-hole on a surface of region to be removed. Durch die Verwendung von sehr kurzen Laserpulsen von 0,1mms - 0,3mms und optional bei relativ hoher Pulsfrequenz von 20Hz - 30 Hz und sehr geringer Energie von 2 - 3 Joule und Anpassung der Fokuslage (22) ist ein Schutz eines Innenraums (4) nicht notwendig.