POLYMERIZABLE COMPOSITION

Provided is a polymerizable composition containing (A) a polymerization initiator, (B) a polymerizable compound, (C) at least either a tungsten compound or a metal boride, (D) a compound having a maximum absorption wavelength between 300 nm and 450 nm and assuming that the maximum absorbance between...

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Bibliographische Detailangaben
Hauptverfasser:	IKEDA, Kimi, YABUKI, Yoshiharu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Provided is a polymerizable composition containing (A) a polymerization initiator, (B) a polymerizable compound, (C) at least either a tungsten compound or a metal boride, (D) a compound having a maximum absorption wavelength between 300 nm and 450 nm and assuming that the maximum absorbance between 300 nm and 450 nm is 1, having an absorbance of 0.3 or less at a wavelength of 550 nm, and (E) an alkali-soluble binder.