PROCESS FOR MANUFACTURING A FLUID CHANNEL FOR A HEAT EXCHANGER MADE OF ALUMINIUM

The invention relates to a fluid channel for a heat exchanger, comprising a metal sheet, wherein the metal sheet has at least one core region of an aluminum base alloy and at least one structure arranged inside the fluid channel, wherein the structure lies against a surface of the metal sheet and ca...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GRUENENWALD, BERND, KURZ, VOLKER, ENGLERT, PETER
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKINGWITHOUT ESSENTIALLY REMOVING MATERIAL BLASTING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MACHINE TOOLS MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES,OTHERWISE THAN BY ROLLING MECHANICAL ENGINEERING MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PUNCHING METAL SOLDERING OR UNSOLDERING TRANSPORTING WEAPONS WELDING WORKING BY LASER BEAM WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
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Beschreibung
Zusammenfassung:	The invention relates to a fluid channel for a heat exchanger, comprising a metal sheet, wherein the metal sheet has at least one core region of an aluminum base alloy and at least one structure arranged inside the fluid channel, wherein the structure lies against a surface of the metal sheet and can be soldered to the metal sheet in a flux-free manner by way of a first soldering location in a soldering operation, and wherein a soldering region of the metal sheet and a counterpart lie against one another and can be soldered to one another in the same soldering operation as a second soldering location while wetting with flux, wherein an open path between the two soldering locations exists before the soldering operation.