SOLAR CELL MODULE AND METHOD FOR MANUFACTURING SOLAR CELL MODULE

Disclosed is a solar cell module wherein an adhesive property between a back surface electrode and a tab lead is improved via an electroconductive adhesive film, and also a power generation efficiency is improved. The solar cell module comprises: a plurality of silicon cell substrates (2), each havi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	HANAI, DAISUKE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Disclosed is a solar cell module wherein an adhesive property between a back surface electrode and a tab lead is improved via an electroconductive adhesive film, and also a power generation efficiency is improved. The solar cell module comprises: a plurality of silicon cell substrates (2), each having a front surface electrode provided at a side of a light incident surface and having an Al back surface electrode (13) provided on a back surface; a tab lead (3) configured to connect the front surface electrode (11) to the Al back surface electrode (13); and electroconductive adhesive layers (20) configured to connect the tab lead (3) to each of the front surface electrode (11) and the Al back surface electrode (13), respectively. In the Al back surface electrode (13), an opening portion (31) is formed in a connecting portion (30) to the tab lead (3), the opening portion to expose a silicon surface of the silicon cell substrate (2) being provided to be narrower than the tab lead (3) and than the electroconductive adhesive layer (20), and being linearly formed along with the connecting portion (30). The tab lead (3) is bonded, via the electroconductive adhesive layer (20), to the silicon surface of the silicon cell substrate (2) which is exposed via the opening portion (31), while is also bonded to the Al back surface electrode (13).