METHOD FOR BONDING COMPONENTS OF A SPUTTERING TARGET

The invention describes a method for bonding components of a sputtering target, comprising the following steps: providing a first component and a second component, the harder of which has undercut protrusions; positioning them against each other; and pressing them towards each other resulting in a p...

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Bibliographische Detailangaben
1. Verfasser:	LINSBOD, Robert
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES,RIVETS, BOLTS OR WHEELS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METALLURGY PERFORMING OPERATIONS PUNCHING METAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention describes a method for bonding components of a sputtering target, comprising the following steps: providing a first component and a second component, the harder of which has undercut protrusions; positioning them against each other; and pressing them towards each other resulting in a plastic deformation of the material of at least one of the two components, filling the undercuts thereby creating interlocking, as well as the bonded assembly so created, and its recycling. No step creating bonding other than interlocking on a major part of the bonded surface area is necessary.