PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

In embodiments of the invention, a passivation layer is disposed over a side of a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A material configured to adhere to an underfill is disposed over an etched surface of the semiconductor st...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHOY, Henry Kwong-Hin, STEIGERWALD, Daniel A, MO, Qingwei, DIANA, Frederic S, RUDAZ, Serge L, WEI, Frank L
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:In embodiments of the invention, a passivation layer is disposed over a side of a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A material configured to adhere to an underfill is disposed over an etched surface of the semiconductor structure.