NITRIDE-TYPE SEMICONDUCTOR ELEMENT
A nitride-based semiconductor device of the present invention includes a p-type Al d Ga e N layer 25 whose growing plane is an m -plane and an electrode 30 provided on the p-type Al d Ga e N layer 25. The Al d Ga e N layer 25 includes a pAl d Ga e N contact layer 26 that is made of an Al x Ga y In z...
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creator | YOKOGAWA, Toshiya KATO, Ryou ANZUE, Naomi |
description | A nitride-based semiconductor device of the present invention includes a p-type Al d Ga e N layer 25 whose growing plane is an m -plane and an electrode 30 provided on the p-type Al d Ga e N layer 25. The Al d Ga e N layer 25 includes a pAl d Ga e N contact layer 26 that is made of an Al x Ga y In z N (x+y+z=1, x¥0, y>0, z¥0) semiconductor, which has a thickness of not less than 26 nm and not more than 60 nm. The pAl d Ga e N contact layer 26 includes a body region 26A which contains Mg of not less than 4×10 19 cm -3 and not more than 2×10 20 cm -3 and a high concentration region 26B which is in contact with the electrode 30 and which has a Mg concentration of not less than 1×10 21 cm -3 . |
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The Al d Ga e N layer 25 includes a pAl d Ga e N contact layer 26 that is made of an Al x Ga y In z N (x+y+z=1, x¥0, y>0, z¥0) semiconductor, which has a thickness of not less than 26 nm and not more than 60 nm. The pAl d Ga e N contact layer 26 includes a body region 26A which contains Mg of not less than 4×10 19 cm -3 and not more than 2×10 20 cm -3 and a high concentration region 26B which is in contact with the electrode 30 and which has a Mg concentration of not less than 1×10 21 cm -3 .</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181024&DB=EPODOC&CC=EP&NR=2565942B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181024&DB=EPODOC&CC=EP&NR=2565942B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOKOGAWA, Toshiya</creatorcontrib><creatorcontrib>KATO, Ryou</creatorcontrib><creatorcontrib>ANZUE, Naomi</creatorcontrib><title>NITRIDE-TYPE SEMICONDUCTOR ELEMENT</title><description>A nitride-based semiconductor device of the present invention includes a p-type Al d Ga e N layer 25 whose growing plane is an m -plane and an electrode 30 provided on the p-type Al d Ga e N layer 25. 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The Al d Ga e N layer 25 includes a pAl d Ga e N contact layer 26 that is made of an Al x Ga y In z N (x+y+z=1, x¥0, y>0, z¥0) semiconductor, which has a thickness of not less than 26 nm and not more than 60 nm. The pAl d Ga e N contact layer 26 includes a body region 26A which contains Mg of not less than 4×10 19 cm -3 and not more than 2×10 20 cm -3 and a high concentration region 26B which is in contact with the electrode 30 and which has a Mg concentration of not less than 1×10 21 cm -3 .</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | NITRIDE-TYPE SEMICONDUCTOR ELEMENT |
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