Light emitting diode package

Disclosed is a light emitting diode package. The light emitting device includes a package body (210) having a cavity defined by a sidewall and a bottom surface, a light emitting diode (230) disposed in the cavity, a radiator (220) inserted into the package body and disposed below the light emitting...

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Bibliographische Detailangaben
Hauptverfasser: Cho, Young Jun, Kim, Byung Mok, Moon, , Yon Tae, Hwang, Son Kyo, Kwon, Seo Yeon, Jung, Su Jung
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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Beschreibung
Zusammenfassung:Disclosed is a light emitting diode package. The light emitting device includes a package body (210) having a cavity defined by a sidewall and a bottom surface, a light emitting diode (230) disposed in the cavity, a radiator (220) inserted into the package body and disposed below the light emitting diode, and a second electrode pattern disposed around the radiator and electrically connected to the light emitting diode via wire bonding. The second electrode pattern includes a first region to which a wire is bonded, and a second region connected to the first region, and a width of the first region differs from a width of the second region.