Process for producing silicon oxide films from organoaminosilane precursors

A silicon oxide layer is deposited on a substrate by chemical vapor deposition (CVD) by reacting an organoaminosilane precursor, selected from specified categories, with an oxidizing agent under conditions for the formation of a silicon oxide film. Diisopropylaminosilane is the preferred organoamino...

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Bibliographische Detailangaben
Hauptverfasser:	THRIDANDAM, HAREESH, XIAO, MANCHAO, GAFFNEY, THOMAS RICHARD, LEI, XINJIAN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A silicon oxide layer is deposited on a substrate by chemical vapor deposition (CVD) by reacting an organoaminosilane precursor, selected from specified categories, with an oxidizing agent under conditions for the formation of a silicon oxide film. Diisopropylaminosilane is the preferred organoaminosilane precursor for the formation of the silicon oxide film.