Three-dimensionally molded electronic substrate

A device, system and process for fabricating a three-dimensional electronic substrate (200) are disclosed. A substrate may be molded in three-dimensions to fit the form factor of an exterior device frame. Electronics (230) and conductors (220) may be placed onto the three-dimensional surface of the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BALK, CODY ALLEN, FINNEY, BENJAMIN MICHAEL, HOLVERSON, ERIK ALAN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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