Three-dimensionally molded electronic substrate

Three-dimensionally molded electronic substrate

A device, system and process for fabricating a three-dimensional electronic substrate (200) are disclosed. A substrate may be molded in three-dimensions to fit the form factor of an exterior device frame. Electronics (230) and conductors (220) may be placed onto the three-dimensional surface of the...

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Bibliographische Detailangaben
Hauptverfasser: BALK, CODY ALLEN, FINNEY, BENJAMIN MICHAEL, HOLVERSON, ERIK ALAN
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Beschreibung
Zusammenfassung:A device, system and process for fabricating a three-dimensional electronic substrate (200) are disclosed. A substrate may be molded in three-dimensions to fit the form factor of an exterior device frame. Electronics (230) and conductors (220) may be placed onto the three-dimensional surface of the molded substrate, thereby creating a three-dimensional electronic substrate. The three dimensional substrate may then be connected to an exterior frame to allow for electronic functionalities across frame form factors.