BASE OF SURFACE-MOUNT-TYPE ELECTRONIC COMPONENT-USE PACKAGE, AND SURFACE-MOUNT-TYPE ELECTRONIC COMPONENT-USE PACKAGE

A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The externa...

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Bibliographische Detailangaben
Hauptverfasser:	IIZUKA, Minoru, KOJO, Yuka
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal. The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.