Shape memory material on the basis of a structural adhesive

Composition comprises: (a) at least one curable structural adhesive; and (b) at least one thermoplastic elastomer, where the thermoplastic elastomer is present as a penetrating polymer network in the structural adhesive. Independent claims are also included for: (1) a molding subjected to reversible mode of regulation, where the shaping comprises heating the composition to a temperature above the glass transition temperature of the curable structural adhesive when it is an epoxy resin composition, or to a temperature above the melting point the curable structural adhesive when it is a polyurethane composition, shaping the composition under a tension of the elastomer, and cooling the shaped composition below the glass transition temperature of the curable structural adhesive when it is epoxy resin composition, or below the melting point the curable structural adhesive when it is polyurethane composition; (2) a reinforcing element for strengthening of structural components in cavities, comprising a carrier, in which the molding is attached; and (3) reinforcement of structural components in cavities, comprising (i) placing the reinforcing element in the cavity of the structural components, (ii) heating the molding on the reinforcing element to a temperature above the glass transition temperature of the curable structural adhesive when it is epoxy resin composition, or to a temperature above the melting point the curable structural adhesive when it is polyurethane composition, and (iii) curing the curable structural adhesive.