SEMICONDUCTOR DEVICE WITH WIRE MEMBERS ACTING AS STEMS AGAINST FLOW OF BONDING MATERIAL AND CORRESPONDING MANUFACTURING PROCESS

SEMICONDUCTOR DEVICE WITH WIRE MEMBERS ACTING AS STEMS AGAINST FLOW OF BONDING MATERIAL AND CORRESPONDING MANUFACTURING PROCESS

Reliability is improved while curbing manufacturing cost. A semiconductor device (100) includes a substrate (110), an insulating substrate (141 and 142) mounted on the substrate (110), a metal pattern (152 and 155) formed on the insulating substrate (141 and 142), an electronic part mounted on the m...

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Bibliographische Detailangaben
Hauptverfasser: KODAIRA, Yoshihiro, ONISHI, Kazunaga, TAKAMIYA, Yoshikazu, FUNAKOSHI, Takaaki
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Reliability is improved while curbing manufacturing cost. A semiconductor device (100) includes a substrate (110), an insulating substrate (141 and 142) mounted on the substrate (110), a metal pattern (152 and 155) formed on the insulating substrate (141 and 142), an electronic part mounted on the metal pattern (152 and 155) across a bond, and a wire member (201 to 206), separate from a wiring wire, which contains a material repellent to the bond and is formed on the metal pattern (152 and 155) and around the electronic part.