Sub-assembly and method for connecting components with different thermal expansion coefficients

The component assembly (10) has two components (11,12) which are formed of different materials and different coefficient of thermal expansion. The components are communicated with each other via an adhesive material (13). The components are interconnected by a fixed bearing (14) and a movable bearin...

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Bibliographische Detailangaben
Hauptverfasser: Brauch, Michael, van Niekerk, Johann, Hammer, Maik
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:The component assembly (10) has two components (11,12) which are formed of different materials and different coefficient of thermal expansion. The components are communicated with each other via an adhesive material (13). The components are interconnected by a fixed bearing (14) and a movable bearing (15). An independent claim is included for method for connecting two components with different coefficient of thermal expansion.