SURFACE TREATMENT METHOD FOR COPPER FOIL, SURFACE TREATED COPPER FOIL AND COPPER FOIL FOR NEGATIVE ELECTRODE COLLECTOR OF LITHIUM ION SECONDARY BATTERY

Disclosed is a copper foil for a negative electrode collector capable of simultaneously achieving high capacity and long life charge/discharge cycles in a secondary battery, wherein the front and back surfaces are of a uniform shape and, for example, the properties of a silicon active material of a...

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Bibliographische Detailangaben
1. Verfasser:	OGURO, RYOICHI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY
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Beschreibung
Zusammenfassung:	Disclosed is a copper foil for a negative electrode collector capable of simultaneously achieving high capacity and long life charge/discharge cycles in a secondary battery, wherein the front and back surfaces are of a uniform shape and, for example, the properties of a silicon active material of a lithium ion secondary battery are sufficiently realized; and a negative electrode using the copper foil. In one embodiment, a first roughened layer of metallic copper is formed by pulse cathode electrolysis roughening treatment on the surface of an untreated rolled copper foil base material of oxygen-free copper in a first roughening treatment tank (1) filled with a copper-sulphuric acid electrolyte (12), and a second copper-plate layer is formed on the surface of the first roughened layer by smooth copper plating treatment in a second copper plating treatment tank (2) filled with a copper-sulphuric acid electrolyte (22).