RESIN COMPOSITION, PREPREG, AND LAMINATED SHEET

There is provided a resin composition that, despite the fact that the content of an inorganic filler is on approximately the same level as that of the conventional resins, can provide a cured resin product that has a low coefficient of thermal expansion in a plane direction and possesses excellent h...

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Bibliographische Detailangaben
Hauptverfasser:	KATO, Yoshihiro, UENO, Masayoshi, TAKAHASHI, Hiroshi, MIYAHIRA, Tetsuro, OGASHIWA, Takaaki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	There is provided a resin composition that, despite the fact that the content of an inorganic filler is on approximately the same level as that of the conventional resins, can provide a cured resin product that has a low coefficient of thermal expansion in a plane direction and possesses excellent heat resistance and flame retardance. The resin composition comprises an epoxy resin (A), a maleimide compound (B), a curing agent (C), and an inorganic filler (D), the epoxy resin (A) being represented by formula (I):