MICRO-CHANNEL-COOLED HIGH HEAT LOAD LIGHT EMITTING DEVICE

MICRO-CHANNEL-COOLED HIGH HEAT LOAD LIGHT EMITTING DEVICE

Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes an optical macr±- reflector, an array of LEDs and a micro-channel cooler assembly. The array is positioned within the reflector and has a high fill factor and a high a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DAHM, Jonathan, S, JONGEWAARD, Mark, CAMPBELL, Geoff
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BLASTING
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF
HEATING
LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL
LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE
LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS
LIGHTING
MECHANICAL ENGINEERING
NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE
STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR
WEAPONS
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Beschreibung
Zusammenfassung:Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes an optical macr±- reflector, an array of LEDs and a micro-channel cooler assembly. The array is positioned within the reflector and has a high fill factor and a high aspect ratio. The array provides a high irradiance output beam pattern having a peak irradiance of greater than 25W/cm 2 at a work piece surface at least 1 mm away from an outer surface of a window of the reflector. The micro-channel cooler assembly maintains a substantially isothermal state among p-n junctions of the LEDs at less than or equal to 80° Celsius. The micro-channel cooler assembly also provides a common anode substrate for the array. A thermally efficient electrical connection is formed between the array and the common anode substrate by mounting the array to the micro-channel cooler assembly.