Serial link interconnection arrangement for backplane with embedded waveguide

A serial link interconnection arrangement for interconnecting a first printed circuit board (BoardA) with a second printed circuit board (BoardB), both boards being inserted in a backplane of a telecommunication system. The arrangement comprises a waveguide embedded in the backplane. A first end (Wa...

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1. Verfasser: HOOGHE, KOEN
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A serial link interconnection arrangement for interconnecting a first printed circuit board (BoardA) with a second printed circuit board (BoardB), both boards being inserted in a backplane of a telecommunication system. The arrangement comprises a waveguide embedded in the backplane. A first end (WavA) of the waveguide is coupled to the first board (BoardA) via a first connection system (ConA), whilst the second end (WavB) of the waveguide is coupled to the second board (BoardB) via a second connection system (ConB). Each of the connection systems (ConA; ConB) comprises a transceiver (IntA; IntB) adapted to convert a parallel signal received from the printed circuit board (BoardA; BoardB) into a serial stream transmitted to an end (WavA; WavB) of the waveguide via an antenna (AntA; AntB), and vice-versa.