Light emitting diode package

The present invention relates to a light emitting diode package (100) and a lighting device with the same. The light emitting diode package (100) comprises a package body (10) having a first surface (11) and a second surface (12) , wherein the first surface has a mounting portion (13) positioned the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Kim, Sangcheon, Kim, Mangeun, Park, Chilkeun, Choi, Moongoo
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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Beschreibung
Zusammenfassung:The present invention relates to a light emitting diode package (100) and a lighting device with the same. The light emitting diode package (100) comprises a package body (10) having a first surface (11) and a second surface (12) , wherein the first surface has a mounting portion (13) positioned thereon, and a through hole (15) provided therein to pass through the first surface and the second surface, at least one pair of first electrodes (20) on the first surface, at least one pair of second electrodes (30) on the second surface connected to the first electrodes through the through hole respectively, a light emitting diode (40) on the mounting portion connected to the first electrodes electrically, a light wavelength conversion layer (50) positioned on the light emitting diode, and a protective layer (60) on the light wavelength conversion layer for sealing the mounting portion.