PRESSURE SENSITIVE ADHESIVES FOR LOW SURFACE ENERGY SUBSTRATES

A cured adhesive composition comprising: (a) a copolymer comprising the reaction product of: 65 to 94.5 wt % of a C?8#191 acrylate ester, 0.5 to 5 wt % of a polar cross-linkable monomer, and 5-30 wt % of a non polar monomer, wherein the copolymer has a weight average molecular weight of 400,000 to 2,200,000 grains/mole; (b) 30 to 70 parts of a hydrogenated hydrocarbon tackifier per 100 parts of the copolymer; and (c) 0.01 to 3 parts (solid/solid) of a cross-linking agent per 100 parts of the copolymer wherein the cured adhesive has a peel value greater than 6 N/cm when tested according to FINAT test method No. 2 on a low density polyethylene; and further wherein the cured adhesive has a shear value greater than 2000 minutes when tested according to FINAT test method No. 8 on low density polyethylene. The cured adhesive of this disclosure is found to exhibit excellent adhesion to low surface energy substrates.