PROCESS AND ADDITIVE TO IMPROVE ADHESION OF BUILDING COMPOSITIONS TO SUBSTRATES

The present invention relates to the use of an additive as well as a process to improve the adhesion of a mortar to a building substrate, wherein the mortar is mixed with said additive and is applied to a building substrate selected from the group of polystyrene-containing substrates, polyolefin-con...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ABERLE, THOMAS, KOELLIKER, ROBERT, PUSTOVGAR, ANDREY PETROVICH, HEINI, URS, WILLIMANN, HONGLI, WICKI, HANS
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ARTIFICIAL STONE CEMENTS CERAMICS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE CORRECTING FLUIDS DYES FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS LIME, MAGNESIA METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES REFRACTORIES SLAG THEIR PREPARATION OR CHEMICAL WORKING-UP TREATMENT OF NATURAL STONE USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to the use of an additive as well as a process to improve the adhesion of a mortar to a building substrate, wherein the mortar is mixed with said additive and is applied to a building substrate selected from the group of polystyrene-containing substrates, polyolefin-containing substrates or polyvinyl chloride-containing substrates, the additive containing (i) a plasticizer that is liquid at 50° C. or lower, has a boiling point of 100° C. or higher, and that has a solubility parameter δ 25° C. between 22.5 MPa1/2 and MPa1/2; (ii) optionally, a filler that has a BET surface area of at least 40 m2/g; (iii) optionally, a biopolymer, (iv) optionally, a protective colloid; and (v) optionally, a water-insoluble film-forming (co)polymer based on ethylenically unsaturated monomers. The invention also covers an additive and a kit of parts suitable for use in the above process.