SYSTEM AND METHOD FOR OVERMOLDING OF DECORATED PLASTIC PARTS

SYSTEM AND METHOD FOR OVERMOLDING OF DECORATED PLASTIC PARTS

An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAROTAMO, Suriaprakash, QIN, Jeff (Jichen), LI WU BING, Levin, WU, Spring, WANG, Zhong, HILL, Charles, R
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
TELEPHONIC COMMUNICATION
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Beschreibung
Zusammenfassung:An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.