SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SAME

There is provided a solid-state imaging device with reduced size and thickness. An optically opaque pattern has been routed on a glass substrate, and solid-state imaging elements are flip-mounted on the substrate. In contrast, the solid-state imaging device of the present invention uses an optically...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NAKAGIRI, YASUSHI, YAMADA, KIYOHIKO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	There is provided a solid-state imaging device with reduced size and thickness. An optically opaque pattern has been routed on a glass substrate, and solid-state imaging elements are flip-mounted on the substrate. In contrast, the solid-state imaging device of the present invention uses an optically transparent conductive pattern, whereby traces can be formed on a light receiving. Thus, a degree of freedom of trace routing is enhanced, and the size of the solid-state imaging device can be substantially reduced.