METHOD AND DEVICE FOR STRUCTURING A LAYER ARRANGED ON A SUBSTRATE

The invention relates to a method and device for structuring, in a plurality of separated regions, an electrically conductive layer arranged on an electrically insulating substrate. In order to allow an inexpensive structuring of short process duration of the layer (2) arranged on the substrate (1) both in a movement direction of the substrate (11) and transversely thereto in a plurality of regions separated from each other, according to the invention a relative movement of at least one of the cutting tools (5, 18) in the plane of the layer from which material is to be removed is generated with the aid of a positioning system (20), in that the at least one cutting tool (18) is moved transversely to the movement direction of the substrate, wherein the cutting tool moving transversely to the movement direction of the substrate is moved by the positioning system at the same time as the substrate with a corresponding speed and in a corresponding movement direction.