Method for reducing tilt of transparent window during manufacturing of image sensor

A method (S 100) for reducing the tilt of an optical unit during manufacture of an image sensor includes the steps of: providing a semimanufacture of the image sensor (step S10), carrying out a preheating process (step S20), carrying out an adhesive application process (step S30), carrying out an op...

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Bibliographische Detailangaben
Hauptverfasser:	HSU, TIAO-MU, PENG, CHEN-PIN, CHUANG, CHUN-HUA, LIN, CHIEN-HEN, HSIN, CHUNG-HSIEN, CHUANG, YAO-NIEN, CHANG, CHIEN-WEI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method (S 100) for reducing the tilt of an optical unit during manufacture of an image sensor includes the steps of: providing a semimanufacture of the image sensor (step S10), carrying out a preheating process (step S20), carrying out an adhesive application process (step S30), carrying out an optical unit mounting process (step S40), and carrying out a packaging process (step S50). Due to the preheating process (step S20), the semimanufacture (200) will be subjected to a stabilized process environment during the adhesive application process (step S30) and the optical unit mounting process (step S40), so as for the optical unit to remain highly flat once attached to the semimanufacture (200). The method reduces the chances of tilt and crack of the optical unit and thereby contributes to a high yield rate.