MODIFIED POLYAMIDE COMPOSITION CONTAINING AT LEAST ONE PHENOLIC COMPOUND

The use of a phenolic compound for producing a modified polyamide having enhanced mechanical properties is described. A polyamide composition including at least such phenolic compound and optionally reinforcing or filler loads is also described. The composition is preferably a composition for moldin...

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Bibliographische Detailangaben
Hauptverfasser:	SCHANEN, VINCENT, SOTTA, PAUL, ANDRES, OLIVIER, LONG, DIDIER, ODONI, LUDOVIC, VERGELATI, CAROLL
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The use of a phenolic compound for producing a modified polyamide having enhanced mechanical properties is described. A polyamide composition including at least such phenolic compound and optionally reinforcing or filler loads is also described. The composition is preferably a composition for molding, for example in the form of granules or powder, that can be used for the production of articles by injection-molding.