POLYMER THICK FILM SILVER ELECTRODE COMPOSITION FOR USE AS A PLATING LINK

The invention is directed to a polymer thick film silver composition comprising: (a) conductive silver flakes and (b) an organic medium consisting of (1) acrylic organic polymeric binder; and (2) organic solvent. The composition may be processed at a time and energy sufficient to remove all solvent....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CRUMPTON, JOHN, C, DORFMAN, JAY, ROBERT
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Beschreibung
Zusammenfassung:	The invention is directed to a polymer thick film silver composition comprising: (a) conductive silver flakes and (b) an organic medium consisting of (1) acrylic organic polymeric binder; and (2) organic solvent. The composition may be processed at a time and energy sufficient to remove all solvent. The invention is further directed to novel method(s) of circuitry formation on printed wiring board constructions.