Method for manufacturing a press-fit diode and press-fit diode
The method involves soldering semiconductor chip (3) between the base (1) and hand wire (6). The semiconductor chip is provided on upper side and lower side of lead-free alloys (4,5) with low melting point. The head wire is connected with base by diffusion bracing. The alloy is a tin copper alloy, t...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | The method involves soldering semiconductor chip (3) between the base (1) and hand wire (6). The semiconductor chip is provided on upper side and lower side of lead-free alloys (4,5) with low melting point. The head wire is connected with base by diffusion bracing. The alloy is a tin copper alloy, tin silver alloy and tin gold alloy. An independent claim is included for insertion diode. |
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