Heat-resistant polyamide resin composition and method of preparing the same

A polyamide resin produced by polymerization of an aliphatic diamine monomer mixture (A) and polyester resin (B) is disclosed. The aliphatic diamine monomer mixture (A) includes an aliphatic diamine monomer (a1) having 2 to 6 carbon atoms, and an aliphatic diamine monomer (a2) having 6 to 12 carbon...

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Bibliographische Detailangaben
Hauptverfasser:	Young Sub Jin, So Young Know, Bok Nam Jang, Suk Min Jun, Ki Yon Lee, Seung Hyun Jang, San Kyun Im
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	A polyamide resin produced by polymerization of an aliphatic diamine monomer mixture (A) and polyester resin (B) is disclosed. The aliphatic diamine monomer mixture (A) includes an aliphatic diamine monomer (a1) having 2 to 6 carbon atoms, and an aliphatic diamine monomer (a2) having 6 to 12 carbon atoms, with the proviso that (a1) and (a2) are different and have a different number of carbon atoms. A method to produce the polyamide resin is also disclosed. The polyamide resin can have excellent heat resistance, low hygroscopic property and good color.