LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE

High temperature performance hot melt adhesives are formulated for application at low temperature, i.e., below 300° F. Hot melt adhesive formed with metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly us...

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Bibliographische Detailangaben
Hauptverfasser: PATEL, JAGRUTI, B, EODICE, ANDREA, KEYS, LOW, YEW, GUAN
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:High temperature performance hot melt adhesives are formulated for application at low temperature, i.e., below 300° F. Hot melt adhesive formed with metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesive.