Method and structure electrode for producing a metallic conductor path structure

The method comprises providing a control electrode (10) having metallic and/or semi-conductive, conductive portions of the given structure with respect to the remaining regions of an enhanced conductivity, contacting the control electrode partially with an electrolyte containing a metal and generating a current flow on a structure electrode through the electrolyte such that a metallic conductor track structure (16) is formed immediately above the metallic and/or semi-conductive, conductive regions, and connecting the conductor track structure with a carrier material to form a composite. The method comprises providing a control electrode (10) having metallic and/or semi-conductive, conductive portions of the given structure with respect to the remaining regions of an enhanced conductivity, contacting the control electrode partially with an electrolyte containing a metal and generating a current flow on a structure electrode through the electrolyte such that a metallic conductor track structure (16) is formed immediately above the metallic and/or semi-conductive, conductive regions, connecting the conductor track structure with a carrier material to form a composite, and removing the composite of conductor track structure and carrier material from the electrode structure. The surface regions of the electrode is formed with the enhanced conductivity such that it is treated physically and/or chemically, and/or the conductor track structure forming metal is selected and/or the material of the structure electrode is selected such that the patterned metal layer of the structure electrode is removed, where the structured metal layer of the structure electrode remains during the contact of the control electrode. The electrode structure: is partially formed from stainless steel and/or mirror-polished in regions and/or physically or chemically coated in some regions; and comprises structured, an electrically insulation layer (12). A surface roughness of the structure electrode is 10 nm. A layer thickness of the conductor track structure is 10 times greater than an insulation layer thickness. The carrier material is applied, in solid or liquid state, on the electrode structure or the structured metal layer in a roll-to-roll process. The structured metal layer is transferred to a second carrier material after transferring to the first carrier material. Verfahren zur Herstellung einer metallischen Leiterbahnstruktur (16), umfassend die Schritte: a. Bereitstellung einer