SUPPORTED PCD AND MANUFACTURING METHOD THEREOF USING LOW BINDER WC-SUBSTRATE

An cutting element incorporates a non-magnetic and electrically conductive substrate on which a layer of polycrystalline diamond particles is sintered to the substrate. An method of forming a cutting element comprises sintering the substrate, a layer of diamond particles and a catalyst source at a p...

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Bibliographische Detailangaben
1. Verfasser:	WEBB, Steven, W
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CHEMISTRY EARTH DRILLING EARTH DRILLING, e.g. DEEP DRILLING FERROUS OR NON-FERROUS ALLOYS FIXED CONSTRUCTIONS METALLURGY MINING OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR ASLURRY OF MINERALS FROM WELLS TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	An cutting element incorporates a non-magnetic and electrically conductive substrate on which a layer of polycrystalline diamond particles is sintered to the substrate. An method of forming a cutting element comprises sintering the substrate, a layer of diamond particles and a catalyst source at a pressure greater than 20 kbar and a temperature greater than 1200° C. to form a layer of polycrystalline diamond particles bonded to the substrate. Cutting elements incorporating non-magnetic and electrically conductive substrates can be sectioned using ablation techniques, such as laser cutting.