LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

A laser processing device (100) is provided with a seed LD (2) that emits a seed beam, an excitation LD (3) that emits an excitation beam, and optical fibers (1, 8) configured such that the seed beam is amplified by injecting the seed beam and the excitation beam. As the seed beam, the seed LD (2) r...

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Bibliographische Detailangaben
Hauptverfasser:	OKABAYASHI, TAKAFUMI, FUKUI, HIROSHI, ISHIZU, YUICHI, OGAKI, TATSUO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES USING STIMULATED EMISSION ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A laser processing device (100) is provided with a seed LD (2) that emits a seed beam, an excitation LD (3) that emits an excitation beam, and optical fibers (1, 8) configured such that the seed beam is amplified by injecting the seed beam and the excitation beam. As the seed beam, the seed LD (2) repeatedly generates a pulse train containing multiple beam pulses. The time interval between the multiple optical pulses is shorter than the interval between the pulse trains. Further, at least one of the following can be varied: the number of beam pulses, the pulse width, the amplitude and the interval.