MOUNTING SUBSTRATE FOR SEMICONDUCTOR LIGHT EMITTING ELEMENT, BACKLIGHT CHASSIS, DISPLAY DEVICE AND TELEVISION RECEIVER

Disclosed are a mounting substrate for semiconductor light emitting elements, a backlight chassis containing the substrate, a display device and a television receiver. The manufacture of the substrate does not involve an increase in the number of steps, and the substrate has a simple structure that allows good heat dissipation of heat from semiconductor light emitting elements, and can suppress temperature increases when mounted thereupon with a flip flop-type semiconductor light emitting element. Amounting substrate (1) for semiconductor light emitting elements is provided with: pair of the electrode patterns (4, 5) that respectively connect the positive and negative electrodes of LED chips (2) on an insulating substrate (3) ; and wire patterns (6) that are drawn between the pair of the electrode patterns (4, 5). The pair of the electrode patterns (4, 5) have a larger surface area than the wire patterns (6) . This allows heat from the LED chips (2) to transfer favorably via the large electrode patterns (4, 5) to the insulating substrate (3) . The mounting substrate (1) for semiconductor light emitting elements is attached to a backlight chassis (not shown in the figure).