HIGH-MOLECULAR-WEIGHT COPOLYMER

It is an object of the present invention to provide (1) a copolymer for a cured product that is satisfactory in properties, such as adhesion properties, as a chip stacking adhesive or the like. The present invention is a copolymer comprising repeating units represented by formula (I), formula (II),...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKAHASHI, EIJI, MARUMO, SHINJI, MISHIMA, GOU
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:It is an object of the present invention to provide (1) a copolymer for a cured product that is satisfactory in properties, such as adhesion properties, as a chip stacking adhesive or the like. The present invention is a copolymer comprising repeating units represented by formula (I), formula (II), and formula (III), (wherein R 1 , R 2 , and R 3 each independently represent a hydrogen atom or a methyl group, R 4 represents an alkyl group or a cycloalkyl group, R 5 represents a hydrogen atom or a C 1 to C 6 alkyl group, m, n, and k represent a molar ratio of the respective repeating units, m represents a positive number of 0 or more and less than 1, n and k each independently represent a positive number, and satisfy a relation of m + n + k = 1), and having a weight-average molecular weight in the range of 50,000 to 200,000.