LED ARRAY MODULE AND FABRICATION METHOD THEREOF

Disclosed herein are an LED array module that radiates high-temperature heat emitted from LEDs using a radiation block by attaching LEDs to the radiation block without using a printed circuit board (PCB), and a method of manufacturing the same. The method includes the steps of: attaching an upper conductive layer to a lower conductive layer by an insulative adhesion layer as an intermediate layer; forming an insulating layer on the entire exposed surface of the upper conductive layer and the lower conductive layer; forming a plurality of LED mounting regions by machining the upper conductive layer such that the upper surface of the lower conductive layer is exposed; mounting an LED in each of the LED mounting regions such that power is supplied to the LED by the lower conductive layer and the upper conductive layer; charging each of the LED mounting regions with a resin having insulation properties and transparency; and respectively forming upper separation grooves and lower separation grooves in the upper conductive layer and the lower conductive layer abreast in a width direction such that each of the upper conductive layer and the lower conductive layer is divided into a plurality of slices.