Cooling device for an electric device and method for producing same

The device has a cooling element provided as a housing lid (5) of an electrical device. An electronic circuit is arranged on a printed circuit board (3). A pressing pin (4) is arranged above a power loss producing element (2) of the electronic circuit so that mechanical and thermal contacts to the b...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Hellinger, Leopold, Neumann, Gerhard, Vogt, Gerald
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The device has a cooling element provided as a housing lid (5) of an electrical device. An electronic circuit is arranged on a printed circuit board (3). A pressing pin (4) is arranged above a power loss producing element (2) of the electronic circuit so that mechanical and thermal contacts to the board are ensured. The pressing-pin is manufactured by an injection molding process. The pressing-pin is produced as a seal (6) for a lower housing part (1) and the housing lid made of liquid-silicone. The pressing-pin is pressed with pressing force (F) of 100 to 200 Newton after a mounting step. An independent claim is also included for a method for manufacturing a cooling device for an electrical device.